Epoxy mold release apply to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins. RoHS compliant.Epoxy mold release apply to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins. RoHS compliant.
SKU:ADIB005T6GTGO
| Dimensions | 1 × 1 × 1 in |
|---|
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